- All sections
- C - Chemistry; metallurgy
- C09J - Adhesives; non-mechanical aspects of adhesive processes in general; adhesive processes not provided for elsewhere; use of materials as adhesives
- C09J 11/04 - Non-macromolecular additives inorganic
Patent holdings for IPC class C09J 11/04
Total number of patents in this class: 2704
10-year publication summary
155
|
154
|
255
|
280
|
298
|
243
|
268
|
301
|
280
|
82
|
2015 | 2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 |
Principal owners for this class
Owner |
All patents
|
This class
|
---|---|---|
Nitto Denko Corporation | 7879 |
177 |
Lintec Corporation | 1915 |
144 |
Dexerials Corporation | 1826 |
98 |
Hitachi Chemical Company, Ltd. | 2455 |
92 |
Henkel AG & Co. KGaA | 10129 |
74 |
3m Innovative Properties Company | 18406 |
69 |
Sekisui Chemical Co., Ltd. | 3159 |
68 |
Shin-Etsu Chemical Co., Ltd. | 5132 |
54 |
LG Chem, Ltd. | 17205 |
47 |
The Furukawa Electric Co., Ltd. | 3486 |
44 |
DIC Corporation | 3597 |
42 |
Resonac Corporation | 2233 |
39 |
Showa Denko Materials Co., Ltd. | 629 |
37 |
Zeon Corporation | 3854 |
34 |
Namics Corporation | 393 |
29 |
Sika Technology AG | 2650 |
28 |
Tatsuta Electric Wire & Cable Co., Ltd. | 368 |
28 |
Sumitomo Bakelite Co., Ltd. | 1416 |
24 |
Tesa SE | 1011 |
24 |
The Yokohama Rubber Co., Ltd. | 3929 |
23 |
Other owners | 1529 |